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ᴅᴀʜᴜᴀ ᴇ900 ɴᴠᴍᴇ ᴍ.2 ꜱꜱᴅ 512ɢʙ

 8,430

Adopts high-quality 3D NAND wafer level chip
> Supports PCIe3.0 x4, and NVMe 1.3 protocol
> All-metal cooling plate is included; equipped with intelligent temperature control technology
> Supports TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC
> Low power consumption management

1 in stock

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Description

Specification:

Product Model

E900N512G

Capacity

512 GB

Form Factor

M.2 2280

Port

PCIe Gen 3.0 x 4

Net Weight

Max 8 g (0.02 lb)

Product Dimensions

80.0 mm × 23.0 mm × 4.8 mm (3.15″ × 0.91″ × 0.19″)

Packaging Dimensions

140.5 mm × 105.5 mm × 15.5 mm (5.53″ × 4.15″ × 0.61″)

Memory Component

3D TLC

Power Consumption

2848 mW (max)
528 mW (idle)

S.M.A.R.T

Support

TRIM

Support

Garbage Collection

Support

Sequential Read

Up to 2000 MB/s

Sequential Write

Up to 1450 MB/s

4K Random Read

Up to 90000

4K Random Write

Up to 200000

MTBF

1,500,000 hours

Operating Temperature

0°C to 70°C (32°F to 158°F)

Storage Temperature

–40°C to 85°C (–40°F to 185°F)

Operating Humidity

5%–95% (non-condensing)

Vibration Resistance

7–800 Hz, 3.08 G

Shock Resistance

1500 G/0.5 ms (half sine wave)

TBW

256 TB

Warranty

3-year limited warranty

Reference
Information

1. Capacity calculation: 1 GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage).
2. The dimensions are after installing cooling plate.
3. System configuration of performance test: Intel Z390 Chipset, Intel Core i9-9900KF@3.6GHz, 16GB DDR4,; operating system-Windows 10 x64; testing tool-CrystalDiskMark 6.0.0.
4. Warranty period or maximum write amount (TBW), whichever
comes first.
5. High performance SLC cache has been enabled.

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